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INTEGRATED CIRCUITS
DATA SHEET
PCF8575C Remote 16-bit I/O expander for I2C-bus
Product specification File under Integrated Circuits, IC12 1999 Aug 05
Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
CONTENTS 1 2 3 4 5 6 6.1 6.2 6.3 6.4 6.5 7 7.1 7.2 7.3 7.4 8 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 17 FEATURES GENERAL DESCRIPTION ORDERING INFORMATION BLOCK DIAGRAM PINNING FUNCTIONAL DESCRIPTION Quasi-bidirectional I/Os Addressing Reading from a port (input mode) Writing to the port (output mode) Interrupt CHARACTERISTICS OF THE I2C-BUS Bit transfer START and STOP conditions System configuration Acknowledge LIMITING VALUES HANDLING CHARACTERISTICS I2C-BUS TIMING CHARACTERISTICS DEVICE PROTECTION PACKAGE OUTLINE SOLDERING Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS
PCF8575C
1999 Aug 05
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
1 FEATURES
PCF8575C
* Operating supply voltage from 4.5 to 5.5 V * Low standby current consumption of 10 A maximum * I2C-bus to parallel port expander * 400 kbits/s FAST I2C-bus * Open-drain interrupt output * 16-bit remote I/O port for the I2C-bus * Compatible with most microcontrollers * Latched outputs with high current drive capability for directly driving LEDs * Address by 3 hardware address pins for use of up to 8 devices * SSOP24 package. 2 GENERAL DESCRIPTION The device consists of a 16-bit quasi-bidirectional port and an I2C-bus interface. The PCF8575C has a low current consumption and includes latched outputs with high current drive capability for directly driving LEDs. It also possesses an interrupt line (INT) which can be connected to the interrupt logic of the microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I2C-bus. This means that the device is an I2C-bus slave transmitter/receiver. Every data transmission from the PCF8575C must consist of an even number of bytes, the first byte will be referred to as P07 to P00 and the second byte as P17 to P10. The third will be referred to as P07 to P00 and so on.
The device is a silicon CMOS circuit. It provides general purpose remote I/O expansion for most microcontroller families via the two-line bidirectional bus (I2C-bus). 3 ORDERING INFORMATION TYPE NUMBER PCF8575CTS
PACKAGE NAME SSOP24 DESCRIPTION plastic shrink small outline package; 24 leads; body width 5.3 mm VERSION SOT340-1
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
4 BLOCK DIAGRAM
PCF8575C
handbook, full pagewidth
INT A0 A1 A2 SCL SDA
1 21 2 3 22 23 INPUT FILTER
INTERRUPT LOGIC
LP FILTER
PCF8575C
I2C-BUS CONTROL
P00 to P07 4 to 11 SHIFT REGISTER 16 BITS I/O PORT P10 to P17 13 to 20
WRITE pulse VDD VSS 24 12 POWER-ON RESET READ pulse
MGS630
Fig.1 Block diagram.
1999 Aug 05
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
5 PINNING SYMBOL INT A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 VSS P10 P11 P12 P13 P14 P15 P16 P17 A0 SCL SDA VDD PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION interrupt output (active LOW) address input 1 address input 2
handbook, halfpage
PCF8575C
quasi-bidirectional I/O 00 quasi-bidirectional I/O 01 quasi-bidirectional I/O 02 quasi-bidirectional I/O 03 quasi-bidirectional I/O 04 quasi-bidirectional I/O 05 quasi-bidirectional I/O 06 quasi-bidirectional I/O 07 supply ground quasi-bidirectional I/O 10 quasi-bidirectional I/O 11 quasi-bidirectional I/O 12 quasi-bidirectional I/O 13 quasi-bidirectional I/O 14 quasi-bidirectional I/O 15 quasi-bidirectional I/O 16 quasi-bidirectional I/O 17 address input 0 serial clock line input serial data line input/output supply voltage
INT 1 A1 2 A2 3 P00 4 P01 5 P02 6
24 VDD 23 SDA 22 SCL 21 A0 20 P17 19 P16
PCF8575C
P03 7 P04 8 P05 9 P06 10 P07 11 VSS 12
MGS631
18 P15 17 P14 16 P13 15 P12 14 P11 13 P10
Fig.2 Pin configuration.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
6 6.1 FUNCTIONAL DESCRIPTION Quasi-bidirectional I/Os
PCF8575C
The 16 ports (see Fig.3) are entirely independent and can be used either as input or output ports. Input data is transferred from the ports to the microcontroller in the READ mode (see Fig.6). Output data is transmitted to the ports in the WRITE mode (see Fig.5). This quasi-bidirectional I/O can be used as an input or output without the use of a control signal for data direction. At power-on all the I/Os are in 3-state mode. The strong pull-up to VDD (IOHt) allows a fast rising edge into a heavily loaded output. This strong pull-up turns on when the output is written HIGH, and is switched off by the negative edge of SCL. After this short period the output is in 3-state mode. The I/O should be written HIGH before being used as an input. After power-on as all the I/Os are set to 3-state all of them can be used as inputs. Any change in setting of the I/Os as either inputs or outputs can be done with the write mode. Warning: If a HIGH is applied to an I/O which has been written earlier to LOW, a large current (IOL) will flow to VSS (see Chapter 10; note 3).
handbook, full pagewidth
write pulse IOHt data from shift register D FF CI power-on reset D FF read pulse data to shift register CI S Q S Q IOL
VDD
P00 to P07 P10 to 17
VSS
to interrupt logic
MGS632
Fig.3 Simplified schematic diagram of each I/O.
6.2
Addressing
Figures 4, 5 and 6 show the address and timing diagrams. Before any data is transmitted or received the master must send the address of the receiver via the SDA line. The first byte transmitted after the START condition carries the address of the slave device and the read/write bit. The address of the slave device must not be changed between the START and the STOP conditions. The PCF8575C acts as a slave receiver or a slave transmitter.
handbook, halfpage
slave address
S
0
1
0
0
A2
A1
A0 R/W
A
MGL541
Fig.4 Byte containing the slave address and the R/W bits.
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1999 Aug 05
SCL 1 2 3 4 5 6 7 8 slave address (PCF8575C) SDA S 0 1 0 0 A2 A1 A0 0 A P07 P06 1 start condition WRITE TO PORT R/W acknowledge P05 from slave
Philips Semiconductors
Remote 16-bit I/O expander for I2C-bus
Integral multiples of two bytes
data to port 0
data to port 1
P00
A
P17
P10
A
acknowledge from slave
acknowledge from slave
7
DATA OUTPUT FROM PORT tpv 05 OUTPUT VOLTAGE IOHt 05 PULL-UP OUTPUT CURRENT INT t ir
Data A0 and B0 valid
MGS633
Product specification
PCF8575C
Fig.5 WRITE mode (output).
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1999 Aug 05
SCL SDA S 0 1 0 0 A2 A1 A0 1 A P07 P06 P05 P04 P03 P02 P01 P00 A P17 R/W READ FROM PORT acknowledge from slave acknowledge from receiver DATA INTO PORT P07 to P00 P17 to P10 th INT P07 to P00
Philips Semiconductors
Remote 16-bit I/O expander for I2C-bus
P10
A
P07
P00
A
P17
P10
1
P
acknowledge from receiver
acknowledge from receiver
non acknowledge from receiver
8
P17 to P10 tsu
P07 to P00
P17 to P10
tiv
tir
tir
MGL543
Product specification
PCF8575C
A LOW-to-HIGH transition of SDA, while SCL is HIGH is defined as the STOP condition (P). Transfer of data can be stopped at any moment by a STOP condition. When this occurs, data present at the latest acknowledge phase is valid (output mode). Input data is lost.
Fig.6 READ mode (input).
Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
6.3 Reading from a port (input mode) 6.5 Interrupt
PCF8575C
All ports programmed as input should be set to logic 1. To read, the master (microcontroller) first addresses the slave device after it receives the interrupt. By setting the last bit of the byte containing the slave address to logic 1 the read mode is entered. The data bytes that follow on the SDA are the values on the ports. If the data on the input port changes faster than the master can read, this data may be lost. 6.4 Writing to the port (output mode)
The PCF8575C provides an open-drain interrupt (INT) which can be fed to a corresponding input of the microcontroller (see Figs 5, 6 and 8). This gives these chips a kind of a master function which can initiate an action elsewhere in the system. An interrupt is generated by any rising or falling edge of the port inputs. After time tiv the signal INT is valid. The interrupt disappears when data on the port is changed to the original setting or data is read from or written to the device which has generated the interrupt. In the write mode the interrupt may become deactivated (HIGH) on the rising edge of the write to port pulse. On the falling edge of the write to port pulse the interrupt is definitely deactivated (HIGH). The interrupt is reset in the read mode on the rising edge of the read from port pulse. During the resetting of the interrupt itself any changes on the I/Os may not generate an interrupt. After the interrupt is reset any change in I/Os will be detected and transmitted as an INT.
To write, the master (microcontroller) first addresses the slave device. By setting the last bit of the byte containing the slave address to logic 0 the write mode is entered. The PCF8575C acknowledges and the master sends the first data byte for P07 to P00. After the first data byte is acknowledged by the PCF8575C, the second data byte P17 to P10 is sent by the master. Once again the PCF8575C acknowledges the receipt of the data after which this 16-bit data is presented on the port lines. The number of data bytes that can be sent successively is not limited. After every two bytes the previous data is overwritten. The first data byte in every pair refers to Port 0 (P07 to P00), whereas the second data byte in every pair refers to Port 1 (P17 to P10), see Fig.7.
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First Byte 07 06 05 04 03 02 01 00 A 17 16 15
Second Byte 14 13 12 11 10 A
P07 P06 P05 P04 P03 P02 P01 P00
P17 P16 P15 P14 P13 P12 P11 P10
MGL545
Fig.7 Correlation between bits and ports.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575C
handbook, full pagewidth
VDD
PCF8575C (1)
PCF8575C (2)
PCF8575C (8)
MICROCOMPUTER INT
INT
INT
INT
MGS634
Fig.8 Application of multiple PCF8575Cs with interrupt.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
7 CHARACTERISTICS OF THE I2C-BUS 7.4 Acknowledge
PCF8575C
The I2C-bus is for bidirectional, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. 7.1 Bit transfer
The number of data bytes transferred between the START and the STOP conditions from transmitter to receiver is not limited. Each byte of eight bits is followed by one acknowledge bit. The transmitter must release the SDA line before the receiver can send an acknowledge bit. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse, set-up and hold times must be taken into account. A master receiver must signal an end of data to the transmitter by not generating an acknowledge after the last byte that has been clocked out of the slave. This is done by the master receiver by holding the SDA line HIGH. In this event the transmitter must release the data line to enable the master to generate a STOP condition.
One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals (see Fig.9). 7.2 START and STOP conditions
Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the STOP condition P (see Fig.10). 7.3 System configuration
A device generating a message is a `transmitter', a device receiving the message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves' (see Fig.11).
handbook, full pagewidth
SDA
SCL data line stable; data valid change of data allowed
MBC621
Fig.9 Bit transfer.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575C
handbook, full pagewidth
SDA
SDA
SCL S START condition P STOP condition
SCL
MBC622
Fig.10 Definition of START and STOP conditions.
SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER
MBA605
SLAVE RECEIVER
MASTER TRANSMITTER
Fig.11 System configuration.
handbook, full pagewidth
DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START condition clock pulse for acknowledgement
MGL539
1
2
8
9
Fig.12 Acknowledgment on the I2C-bus.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); note 1. SYMBOL VDD IDD ISS VI II IO Ptot PO Tstg Tamb Note supply voltage supply current supply current input voltage DC input current DC output current total power dissipation power dissipation per output storage temperature ambient temperature PARAMETER - - VSS - 0.5 - - - - -65 -40 MIN. -0.5
PCF8575C
MAX. +6.5 100 100 VDD + 0.5 20 25 400 100 +150 +85 V
UNIT mA mA V mA mA mW mW C C
1. Stress above those listed under `Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 9 HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take precautions appropriate to handling MOS devices. Advice can be found in Data Handbook IC12 under "Handling MOS Devices". 10 CHARACTERISTICS VDD = 4.5 to 5.5 V; VSS = 0 V; Tamb = -40 to +85 C; unless otherwise specified. SYMBOL Supplies VDD IDD supply voltage supply current operating mode; no load; VI = VDD or VSS; fSCL = 400 kHz standby mode; no load; VI = VDD or VSS note 1 4.5 - - 100 5.5 200 V A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IDD(stb) VPOR VIL1 VIL2 VIH1 VIH2
standby current Power-on reset voltage LOW-level input voltage pins A0, A1, A2, SDA and SCL LOW-level input voltage pins P00 to P17 HIGH-level input voltage pins A0, A1, A2, SDA and SCL HIGH-level input voltage pins P00 to P17
- - -0.8 -0.8 0.7VDD 0.8VDD
2.5 1.2 - - - -
10 1.8 0.3VDD 0.6VDD
A V V V
VDD + 0.8 V VDD + 0.8 V
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
PCF8575C
SYMBOL IL IIHL
PARAMETER leakage current at all pins current through protection diode
CONDITIONS VI = VDD or VSS VI > VDD or VI < VSS; note 2 -2 -
MIN. - -
TYP.
MAX. +2 2
UNIT A mA
Input SCL; input/output SDA IOL CI IOL IOHt CI CO LOW-level output current input capacitance VOL = 0.4 V; note 3 VI = VSS; note 2 VOL = 1 V; note 3 VOH = VSS; see Fig.5 note 2 note 2 3 - 10 -0.5 - - - 0 4 - - 25 -1.0 - - - - - - - - - 7 - - 10 10 mA pF
I/Os; P00 to P07 and P10 to P17 LOW-level output current transient pull-up current input capacitance output capacitance mA mA pF pF s s s mA s s
Port timing; CL 100 pF (see Figs 5 and 6) tpv tsu th IOL tiv tir Notes 1. The Power-on reset circuit resets the I2C-bus logic with VDD < VPOR and sets all I/Os to logic 1 (with current source to VDD). 2. The value is not tested, but verified on sampling basis. 3. A single LOW-level output current (IOL) must not exceed 20 mA for an extended time. The sum of all IOLs at any point in time must not exceed 100 mA. output data valid input data set-up time input data hold time 4 - - - 4 4
Interrupt INT (see Fig.13) LOW-level output current VOL = 0.4 V 1.6 - - TIMING; CL 100 PF (see Figs 5 and 6) input data valid time reset delay time
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
11 I2C-BUS TIMING CHARACTERISTICS See Fig.13 and note 1. SYMBOL fSCL tSW tBUF tSU;STA tHD;STA tLOW tHIGH tr tf tSU;DAT tHD;DAT tSU;STO Cb Notes PARAMETER SCL clock frequency tolerable spike width on bus BUS free time between a STOP and START condition START condition set-up time START condition hold time SCL LOW time SCL HIGH time SCL and SDA rise time SCL and SDA fall time data set-up time data hold time STOP condition set-up time capacitive load represented by each bus line note 3 note 3 note 2 CONDITIONS - - 1.3 0.6 0.6 1.3 0.6 20 + 0.1Cb 20 + 0.1Cb 100 0 0.6 - MIN. 400 50 - - - - - 300 300 - - - 400
PCF8575C
MAX.
UNIT kHz ns s s s s s ns ns ns ns s pF
1. All the timing values are valid within the operating supply voltage and ambient temperature range and refer to VIL and VIH with an input voltage swing of VSS to VDD. 2. The device inputs SDA and SCL are filtered and will reject spikes on the bus lines of widths less than tSW(max). 3. The rise and fall times specified here refer to the driver device (PCF8575C) and are part of the general fast I2C-bus specification when PCF8575C asserts an acknowledge on SDA, the minimum fall time is 20 ns + 0.1Cb.
handbook, full pagewidth
PROTOCOL
START CONDITION (S)
BIT 7 MSB (A7)
BIT 6 (A6)
BIT 0 LSB (R/W)
ACKNOWLEDGE (A)
STOP CONDITION (P)
tSU;STA
tLOW
tHIGH
1/fSCL
SCL
tBUF
tr
tf
SDA
tHD;STA
tSU;DAT
tHD;DAT
tSU;STO
MGL546
Fig.13 I2C-bus timing diagram.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
12 DEVICE PROTECTION
PCF8575C
handbook, full pagewidth
INT A1 A2 P00 P01 P02 P03 P04 P05 P06 P07 VSS
1 2
VDD
24 23
VDD SDA SCL A0 P17 P16 P15 P14 P13 P12 P11 P10
3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13
substrate VSS
MGS635
Fig.14 Device protection diagram.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
13 PACKAGE OUTLINE SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
PCF8575C
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
14 SOLDERING 14.1 Introduction to soldering surface mount packages
PCF8575C
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 14.4 Manual soldering
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. 14.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. 14.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
14.5 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
PCF8575C
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
15 DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF8575C
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 16 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575C
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575C
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Philips Semiconductors
Product specification
Remote 16-bit I/O expander for I2C-bus
NOTES
PCF8575C
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Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465006/01/pp24
Date of release: 1999
Aug 05
Document order number:
9397 750 06117

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